Nu-Hup Teck
Nu-Hup Teck

DIAPLUS - Single Component Bonding Agent

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DiaPlus™ is a 5th generation bonding agent with high bonding strength.

  • Optimizes the enamel etching procedure in conjunction with all light-curing restorative materials
  • Designed for both direct and indirect applications (enamel, dentin, porcelain, ceramics, amalgam, etc.)
  • Low film thickness prevents adhesive show-through and creates a beautiful final restoration
    Ethanol-based bonding agent: exceptional bond strength
  • Compatible with dual- and self-cure composites and core material

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